02 — IP PLATFORMS & KNOW-HOW
Engineering platforms designed to compound.
可持續累積、延伸與商業化的工程平台。
LMC’s technology base spans motor control, Power SoC, low-power sensing,
advanced packaging and system-level engineering. During incubation,
most of this work is protected as confidential know-how and trade secrets.
LMC 的技術基礎涵蓋馬達控制、Power SoC、低功耗感測、先進封裝與系統級工程;
在育成階段,多數成果以機密 know-how 與營業秘密方式保護。
A
MOTION & POWER SOC
運動控制與 Power SoC
SoC-based motor control
SoC 型馬達控制
LMC advanced SoC-based motor-control technology previously developed
in Mainland China for home-appliance applications.
延續先前於中國大陸為家電應用開發的 SoC 型馬達控制技術,
並由 LMC 持續推進。
→ RobiSoC / RobiDev
B
LOW-POWER SENSING
低功耗感測
Ultra-low-power sensing
超低功耗感測
During COVID-19, LMC co-founded a cold-chain technology start-up with
a physician, developing ultra-low-power temperature monitoring and securing three U.S. patents.
COVID-19 期間與醫師共同創辦冷鏈科技新創,開發超低功耗溫度監測技術,
並取得三件美國專利。
→ Three U.S. patents secured by the operating venture→ 由營運事業取得三件美國專利
C
ADVANCED PACKAGING & SYSTEMS
先進封裝與系統技術
Package-to-system IP
從封裝延伸至系統的 IP
LMC incubated motor-driver, Power SoC, advanced-packaging and system-level
technologies that supported the establishment of RobiChip in June 2025.
LMC 育成馬達驅動、Power SoC、先進封裝與系統級技術,
並支持 RobiChip 於 2025 年 6 月成立。
Formalized within RobiChip · 由 RobiChip 推動權利化
Hybrid Substrate SoC
Smart Substrate
System Thermal Platform
AI
DOMAIN AI & ENGINEERING WORKFLOWS
LMC-Agent | Design workflow automation
LMC-Agent applies AI agents across simulation, design review, validation,
prototyping, pilot production and manufacturing feedback—helping reduce the
gap between engineering intent and production reality.
透過 AI Agent 串接模擬、設計審查、驗證、原型開發、試產及量產回饋,
縮小工程設計意圖與實際量產結果之間的落差。
- Workflow automation設計流程自動化
- Knowledge continuity跨部門工程知識延續
- Design-to-production加速設計至量產